Wiring harness assembly having multiple separated conductors embedded within a substrate

ABSTRACT

A wiring harness assembly includes a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, a location feature integrally formed with the substrate, and an opening defined in the substrate located within a predetermined tolerance relative to the location feature. A section of the plurality of electrically conductive wires is exposed within the opening.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation application and claims the benefit under 35U.S.C. § 120 of U.S. patent application Ser. No. 16/203,691, filed Nov.29, 2018 which claimed the benefit under 35 U.S.C. § 119(e) of U.S.Provisional Patent Application No. 62/671,607 filed on May 15, 2018 andthe benefit of U.S. Provisional Patent Application No. 62/594,831 filedon Dec. 5, 2017, the entire disclosure of each is hereby incorporated byreference.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a wiring harness assembly that includesmultiple separated conductors that are embedded within a substrate.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

The present invention will now be described, by way of example withreference to the accompanying drawings, in which:

FIG. 1 is a perspective view of an electrical wiring harness, inaccordance with one embodiment of the invention;

FIG. 2 is a close-up view of an aperture in the electrical wiringharness of FIG. 1, in accordance with one embodiment of the invention;

FIG. 3 is a cross section view of an upper and lower support within theaperture of FIG. 2, in accordance with one embodiment of the invention;

FIG. 4 is a perspective view an electrical wiring harness assemblyincluding the electrical wiring harness of FIG. 1, in accordance withone embodiment of the invention;

FIG. 5 is a close-up view of the lower support of FIG. 3, in accordancewith one embodiment of the invention;

FIG. 6 is a close-up cross section view of wires in the lower support ofFIG. 3, in accordance with one embodiment of the invention;

FIG. 7 is a cross section view of terminals in the upper support of FIG.3 engaging the wires supported by the lower support shown in FIG. 6, inaccordance with one embodiment of the invention;

FIG. 8 is a cross section view of seals between the upper support andsubstrate, the lower support and substrate and the upper support and thelower support, in accordance with one embodiment of the invention;

FIG. 9 is a perspective view of the electrical wiring harness disposedon a portion of the vehicle structure, in accordance with one embodimentof the invention;

FIG. 10 is a schematic view of an apparatus configured to manufacturethe electrical wiring harness of FIG. 1, in accordance with anotherembodiment of the invention; and

FIG. 11 is a flow chart of a method of operating the apparatus of FIG.10, in accordance with yet another embodiment of the invention.

DETAILED DESCRIPTION OF TITLE INVENTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the following detaileddescription, numerous specific details are set forth in order to providea thorough understanding of the various described embodiments. However,it will be apparent to one of ordinary skill in the art that the variousdescribed embodiments may be practiced without these specific details.In other instances, well-known methods, procedures, components,circuits, and networks have not been described in detail so as not tounnecessarily obscure aspects of the embodiments.

Presented herein is an assembly that includes a number of conductorsthat a separated from one another and are encased or embedded within asubstrate. The substrate defines a location feature. The substrate alsodefines an opening that has a predetermined size and shape. A section ofthe plurality of separated conductors is exposed within the opening. Theopening is precisely located relative to the location feature. Theassembly, particularly a portion of the substrate that defines thelocation feature and the opening, may be advantageously formed by anautomated additive manufacturing process, e.g. 3D printing,stereolithography, digital light processing, fused deposition modeling,fused filament fabrication, selective laser sintering, selecting heatsintering, multi-jet modeling, multi-jet fusion, electronic beammelting, and/or laminated object manufacturing.

The examples presented herein are directed to assemblies in which theconductors are wire electrical conductors. However, other embodiments ofthe assembly may be envisioned wherein the conductors are fiber optic,pneumatic, hydraulic conductors, or a hybrid assembly having combinationof any of these conductors.

FIG. 1 illustrates an example of an automotive wiring harness assemblyaccording to an embodiment of this invention, hereinafter referred to asthe assembly 100. The assembly 100 includes a plurality of wires 102that are formed of an electrically conductive material, e.g. a metallicalloy, carbon nanostructures, and/or electrically conductive polymers.These wires 102 are separated from one another and are enclosed within,i.e. surrounded by, a substrate 104 that is integrally formed of anelectrically, insulative material, e.g. a dielectric polymer. As shownin FIG. 2, the substrate 104 also defines an aperture 106 that extendsthrough the substrate 104 and in which a section of the wires 102 areexposed. Referring again to FIG. 1, the substrate 104 defines a locationfeature 108, e.g. a fiducial mark, an edge, a corner, a notch, a slot,or a hole on/in the substrate 104, that can be used by a human operatoror preferably an automated assembly robot (not shown) to determine thelocation of the aperture 106. The aperture 106 is precisely locatedrelative to the location feature 108. As used herein, “preciselylocated” means that the position tolerance of the opening relative tothe location feature datum is 1 millimeter or less. The positiontolerance of the opening may be determined by the capability of themanufacturing technology and/or the capability of the automated assemblyrobot. This locational relationship between the location feature 108 andthe aperture 106 provides the benefit of adding connectors or electronicmodules to the assembly 100 using robots rather than requiring humanassembly operators. The wires 102 are also precisely located relative toone another and relative to the edges of the aperture 106. As shown inFIG. 1, the substrate 104 surrounds the aperture 106. The exposedsection of the wires 102 within the aperture 106 in this example have anelectrically conductive surface that is not covered by an insulativejacket. The wires 102 are arranged and maintained by the substrate 104in a predetermined order. In alternative embodiments, the exposedsection of the wires 102 within the aperture 106 may be covered by aninsulative jacket. As shown in FIG. 1, the assembly 100 includes severalapertures 106 in which several subsets of the wires 102 are exposed. Asfurther shown in FIG. 1, different sections of the same wires may beexposed in more than one aperture. This provides the benefit of allowingmultiple connectors to be attached to the same wires. This may provideeasy access to power or signal busses that are connected to more thanone connector or electronic module.

This assembly 100 lends itself to being manufactured using an automatedadditive manufacturing process, such as 3D printing, stereolithography,digital light processing, fused deposition modeling, fused filamentfabrication, selective laser sintering, selecting heat sintering,multi-jet modeling, multi-jet fusion, electronic beam melting, and/orlaminated object manufacturing. The assembly 100 may be produced by theautomated additive manufacturing process having a shape that ispre-formed to be placed within the packaging accommodation for thewiring harness within a vehicle. The assembly 100 is also well suitedfor robotic placement of the assembly 100 within the vehicle.

As illustrated in FIG. 2, the wires 102 may have different diametersdepending on the current carrying capabilities required by circuitsformed by the wires 102.

As illustrated in FIG. 3, the assembly 100 further includes a connector110 having a lower support segment 112 disposed within the aperture 106that is secured to the substrate 104 by a lower locking feature 114. Thelower support segment 112 defines cradle features 116, shown in FIGS. 4and 5, having a plurality of concave arcuate surfaces that contact alower portion of the each of the wires 102, thereby supporting the wires102 within the aperture 106. In alternative embodiments, the lowersupport segment 112 may be integrally formed with the substrate 104.

Returning to FIG. 3, the connector 110 further includes an upperconnector segment 118 that is received within the lower support segment112 and is secured to the lower support segment 112 by an upper lockingfeature 120. The upper connector segment 118 includes a plurality ofterminals 122. The terminals 122 have a first end 124 that is inmechanical and electrical contact with the wires 102 and a second end126 that is configured to mate with a corresponding mating terminal (notshown) to form an electrical connection with a separate electricaldevice (not shown), e.g. an electronic control module, a lightingmodule, an electronic sensor, and/or another electrical wiring harness.In alternative embodiments, the upper connector segment 118 may beintegrally formed with the substrate 104 and connected to the substrate104 by a living hinge. As illustrated in FIG. 3, the assembly 100includes several connectors. The terminals 122 in one of theseconnectors may be connected to wires 102 common with the terminals 122in another connector 110. Alternatively, one of these connectors may notinclude terminals 122 that are connected to wires 102 common to any ofthe other connectors.

As illustrated in FIG. 7, the first end 124 of each terminal 122 definesa forked end 128 that has two tines 130. A wire 102 is received betweenthe two tines 130. The walls of the two tines 130 are angled so that thetwo tines 130 are in compressive contact with the wire 102 when theupper connector segment 118 is fully seated within the lower supportsegment 112. In alternative embodiments in which the exposed section ofthe wires 102 within the aperture 106 is covered by an insulativejacket, the two tines 130 are also configured to cut through anddisplace the insulative jacket so that the terminal 122 can makecompressive electrical contact with the wire 102 within. As shown inFIG. 5, the lower support segment 112 defines a plurality of recesses inwhich the ends of the two tines 130 of the plurality of terminals 122are received. The cradle features 116 of the lower support segment 112support the wires 102 to inhibit bending of the wire 102 as the wire 102is received within the two tines 130 of the terminal 122 and the twotines 130 come into compressive contact with the wires 102.

In an alternative embodiment of the assembly 100, the wires 102 have acoating that is formed of an electrically conductive material (e.g. puretin or a tin-based solder) that has a lower melting point than theconductive material forming the wires 102. The terminals 122 aremetallurgically bonded to the wires 102 by a soldering or weldingprocess due to localized heating of a portion of the coating. Thisheating may be performed using a laser, resistive heating of theterminal 122 and the wire 102, application of a soldering iron, or othermeans.

In alternative embodiments of the assembly 100, the upper connectorsegment 118 may be replaced by an upper modular segment that itselfcontains a relay, an electronic controller, an electronic sensor, alighting device, and/or other electronic devices. The upper modularsegment includes terminals 122 that have the first end 124 that is inmechanical and electrical contact with the wires 102 but the second endof the terminal is directly connected to circuitry or electrical orelectronic devices within the upper modular segment rather thancorresponding mating terminals.

As shown in FIGS. 6 and 7, the lower support segment 112 defines a lowerlip 132 that extends laterally from the lower support segment 112 andengages a lower surface of the substrate 104 around a perimeter of theaperture 106. The upper connector segment 118 likewise defines an upperlip 134 engaging an upper surface of the substrate 104 around theperimeter of the opening. The lower and upper lips 132, 134 sandwich thesubstrate 104 therebetween to further secure the lower support segment112 within the aperture 106. This provides the benefit of limitinglongitudinal movement of the connector 110 within the aperture 106.

The lower lip 132 defines a lower groove 136 that contains a lower seal138 that is formed of a compliant material (e.g. a silicone rubber). Thelower seal 138 engages the lower surface of the substrate 104 around theperimeter of the aperture 106 and seals the interface between the lowersupport segment 112 and the substrate 104 to inhibit intrusion ofcontaminants, such as dust and fluids, into the aperture 106, therebyprotecting the terminals 122 and the wires 102 within the aperture 106.The upper lip 134 similarly defines an upper groove 140 that contains anupper seal 142 that is also formed of a compliant material, such assilicone rubber, that engages the upper surface of the substrate 104around the perimeter of the aperture 106 and seals the interface betweenthe upper connector segment 118 and the substrate 104 to inhibitintrusion of contaminants into the aperture 106, thereby protecting theterminals 122 and the wires 102 within the aperture 106. A single sealdesign and construction may be used for the lower seal 138 and the upperseal 142 in order to provide the benefit of reduced number of uniqueparts in the assembly 100.

In alternative embodiments of the assembly 100, the assembly 100 mayfurther include a first inner seal 135 that is located intermediate thelower support segment 112 and an inner surface of the aperture 106 thatengages both the lower support segment 112 and the substrate 104. Theassembly 100 may also include a lower seal 138 that is formed of acompliant material and sealingly engages a lower inner surface of thesubstrate 104 within the aperture 106 to inhibit intrusion ofcontaminants, such as dust and fluids, into the aperture 106. The firstinner seal 135 may be used in addition to, or instead of, the lower seal138. In this or other alternative embodiments, the assembly 100 mayadditionally include a second inner seal 139 that is formed of acompliant material located intermediate the upper connector segment 118and the lower support segment 112 to further inhibit intrusion ofcontaminants into the aperture 106.

As shown in rig. 4, a first region 144 of the substrate 104 surroundingthe opening is thicker than a second region 146 of the substrate 104remote from the opening. This greater thickness of the substrate 104 inthe first region 144 than the second region 146 provides increasedstiffness in the first region 144 relative to the second region 146. Theincreased stiffness in the first region 144 around the aperture 106provides the benefit of a secure connection between the connector 110and the substrate 104 while the decreased stiffness in areas remote fromthe aperture 106 allow the assembly 100 to flex in order to be installedwithin a vehicle. There may also be other regions of varying stiffnessin the harness. These variations may provide benefits of providingmounting features or reducing the probability of the assembly 100rattling when installed in the vehicle.

In alternative embodiments of the assembly 100, the increased stiffnessin the first region 144 relative to the second region 146 may beprovided by the substrate 104 being formed in a particular shape, e.g.including a stiffening rib or beam. The stiffness may also vary due todifferences in the structure of the material, e.g. a lattice structurevs. a solid structure, differences in thickness of the material, or useof different polymer materials having different stiffness propertiese.g. polyamide and polypropylene.

In alternative embodiments of the assembly 100, the substrate 104 is astructural portion of a motor vehicle 147, such as a headliner, trimpanel, body panel, floor liner, or hood liner as shown in FIG. 9.

As shown in FIG. 4, the assembly 100 also includes attachment features148 that are incorporated into the substrate 104. These attachmentfeatures 148 may be used to secure the assembly 100 to the structuralportion of a motor vehicle 147. The attachment features 148 may beintegrally formed by the substrate 104 or they may be discrete partsthat are incorporated into the substrate 104 during the forming of thesubstrate 104 by forming the substrate 104 around a portion of theattachment feature 148. The attachment features 148 shown in FIG. 4 areeyelets that receive a stud, bolt, push pin or other attachment devicehaving a shaft and a head. In alternative embodiments, the attachmentfeatures 148 may be smooth studs, treaded studs, barbed pins, “firtrees” or other attachment features 148 known to those skilled in theart.

Also presented herein is an apparatus that can be used to manufacturethe assembly 100 described above. FIG. 10 illustrates an 3D printingapparatus according to an embodiment of the invention, hereinafterreferred to as the apparatus 200. The apparatus 200 includes anextruding device 202 with a dispensing head 204 that selectivelydispenses a dielectric thermoplastic material though an orifice 206 inthe dispensing head 204. The thermoplastic material may be provided tothe dispensing head 204 in the form of a thermoplastic filament, as usedin filament deposition modeling, thermoplastic pellets, or athermoplastic powder.

The apparatus 200 also includes a wire feed device 208 that selectivelyfeeds an electrically conductive wire, hereinafter referred to as thewire 102, through the orifice 206. A cutting device 210 that isconfigured to selectively sever the wire 102 after it passes through theorifice 206 is also included in the apparatus 200. The wire 102 mayalready be surrounded by an insulative jacket prior to passing throughthe orifice 206.

This apparatus 200 further comprises an electromechanical device 212,such as a robotic arm, that holds the extruding device 202, the wirefeed device 208, and the cutting device 210 and is configured to movethe extruding device 202, the wire feed device 208, and the cuttingdevice 210 within a 3D space.

The apparatus 200 additionally encompasses an electronic controller 214that is in communication with the extruding device 202, the wire feeddevice 208, the cutting device 210, and the electromechanical device212. The electronic controller 214 has one or more processors andmemory. The processors may be a microprocessor, application specificintegrated circuits (ASIC), or built from discrete logic and timingcircuits (not shown). Software instructions that program the processorsmay be stored in a non-volatile (NV) memory device (not shown). The NVmemory device may be contained within the microprocessor or ASIC or itmay be a separate device. Non-limiting examples of the types of NVmemory that may be used include electrically erasable programmable readonly memory (EEPROM), masked read only memory (ROM), and flash memory.The memory device contains instructions that causes theelectromechanical device 212 to move the extruding device 202, the wirefeed device 208, and the cutting device 210 within the 3D space. Theinstructions also cause the extruding device 202 to selectively dispensethe dielectric material though the orifice 206. The instruction furthercauses the wire feed device 208 to selectively feed the wire 102 throughthe orifice 206 and cause the cutting device 210 to selectively severthe wire 102.

The memory device may further contain instructions that causes theextruding device 202 to selectively dispense the dielectric materialthough the orifice 206 as the electromechanically device moves theextruding device 202 in the 3D space to form the substrate 104. Theinstructions additionally cause the wire feed device 208 to selectivelyfeed the wire 102 through the orifice 206, and the cutting device 210 toselectively sever the wire 102 as the electromechanically device movesthe wire feed device 208 and the cutting device 210 in the 3D space toform a plurality of wires 102 formed of the wire 102 that aresubsequently encased within the substrate 104 by the extruding device202. The instructions further cause the electrotechnical device and theextruding device 202 to define a location feature 108 in the substrate104 and define an aperture 106 in the substrate 104 which has apredetermined size and shape in which a portion of the wires 102 isexposed. This aperture 106 is precisely located relative to the locationfeature 108.

According to an alternative embodiment of the apparatus 200, theapparatus 200 further includes a 3D curved surface 216 upon which theextruding device 202 selectively dispenses the dielectric material andthe wire feed device 208 to selectively deposits the conductive wire.This 3D curved surface 216 provides the benefit of forming the assembly100 with a predetermined shape.

This alternative embodiment may also include a heating device 218 incommunication with the electronic controller 214 and is configured toheat a portion of the 3D curved surface 216. The memory device furthercontains instructions that causes the cooling device 220 to selectivelyheat the portion of the curved surface 216. This feature provides thebenefit of heating the thermoplastic material while forming thesubstrate 104 in order to produce a desired shape or materialproperties.

This alternative embodiment may additionally or alternatively include acooling device 220 that is also in communication with the electroniccontroller 214 and is configured to cool a portion of the 3D curvedsurface 216. The memory device further contains instructions that causesthe cooling device 220 to selectively cool the portion of the curvedsurface 216. This feature provides the benefit of cooling thethermoplastic material while forming the substrate 104 in order toproduce a desired shape or material properties. The heating device 218and the cooling device 220 may be the same device, e.g. a thermoelectricdevice.

Additionally, a method 300 of operating the apparatus 200, as describedabove, to manufacture the assembly 100, also as described above ispresented herein. FIG. 11 illustrates an example of a method 300 offorming a wiring harness assembly 100 using an apparatus 200 comprisingan extruding device 202 having a dispensing head 204, a wire feed device208, a cutting device 210, an electromechanical device 212, and anelectronic controller 214 in communication with the extruding device202, the wire feed device 208, the cutting device 210, and theelectromechanical device 212.

The steps of the method 300 of operating the apparatus 200 are describedbelow:

STEP 302, DISPENSE A DIELECTRIC MATERIAL USING AN extruding device 202,includes selectively dispensing a dielectric material though an orifice206 in the dispensing head 204 by operating the extruding device 202 inaccordance with a command from the electronic controller 214;

STEP 304, FEED A CONDUCTIVE WIRE USING A WIRE FEED DEVICE, includesselectively feeding a wire 102 through the orifice 206 by operating thewire feed device 208 in accordance with a command from the electroniccontroller 214;

STEP 306, SEVER THE CONDUCTIVE WIRE USING A CUTTING DEVICE, includesselectively severing the wire 102 by operating the cutting device 210 inaccordance with a command from the electronic controller 214;

STEP 308, MOVE THE EXTRUDING DEVICE, THE WIRE FEED DEVICE, AND THECUTTING DEVICE WITHIN A 3D SPACE BY OPERATING AN ELECTROMECHANICALDEVICE, includes moving the extruding device 202, the wire feed device208, and the cutting device 210 within a 3D space by operating theelectromechanical device 212 in accordance with a command from theelectronic controller 214;

STEP 310, FORM A PLURALITY OF ELECTRICALLY CONDUCTIVE WIRES, includesforming a plurality of wires 102 by operating the wire feed device 208,the cutting device 210, and the electromechanical device 212 inaccordance with a command from the electronic controller 214;

STEP 312, FORM A SUBSTRATE, includes forming a substrate 104 made of thedielectric material that encases the plurality of wires 102 by operatingthe extruding device 202 and the electromechanical device 212 inaccordance with a command from the electronic controller 214;

STEP 314, FORM A LOCATION FEATURE, includes forming a location feature108 in the substrate 104 by operating the extruding device 202 and theelectromechanical device 212 in accordance with a command from theelectronic controller 214; and

STEP 316, FORM AN OPENING IN THE SUBSTRATE, includes forming an openingor an aperture 106 in the substrate 104 having a predetermined size andshape in which a portion of plurality of wires 102 is exposed byoperating the extruding device 202 and the electromechanical device 212in accordance with a command from the electronic controller 214, whereinthe opening or aperture 106 is precisely located relative to thelocation feature 108.

In an alternative embodiment of the method 300, the apparatus 200further includes a 3D curved surface 216 and the method 300 furtherincludes a step of selectively dispensing the dielectric material ontothe curved surface 216 by operating the extruding device 202 and theelectromechanical device 212 in accordance with a command from theelectronic controller 214. This embodiment may further include a coolingdevice 220 in communication with the electronic controller 214 andconfigured to cool a portion of the curved surface 216 and the method300 further comprises the step of cooling the portion of the curvedsurface 216 by operating the cooling device 220 in accordance with acommand from the electronic controller 214. This embodiment mayalternatively or additionally include a heating device 218 incommunication with the electronic controller 214 and configured to heata portion of the curved surface 216 and the method 300 further comprisesthe step of heating the portion of the curved surface 216 by operatingthe heating device 218 in accordance with a command from the electroniccontroller 214.

Accordingly, a wiring harness assembly 100, an apparatus 200 configuredto form the wiring harness assembly 100, and a method 300 of operatingthe apparatus 200 is provided. The wiring harness provides the benefitsof allowing robotic assembly of the wiring harness and roboticinstallation of the wiring harness into a vehicle or any othersubassembly.

While this invention has been described in terms of the preferredembodiments thereof, it is not intended to be so limited, but ratheronly to the extent set forth in the claims that follow. For example, theabove-described embodiments (and/or aspects thereof) may be used incombination with each other. In addition, many modifications may be madeto configure a particular situation or material to the teachings of theinvention without departing from its scope. Dimensions, types ofmaterials, orientations of the various components, and the number andpositions of the various components described herein are intended todefine parameters of certain embodiments and are by no means limitingand are merely prototypical embodiments.

Many other embodiments and modifications within the spirit and scope ofthe claims will be apparent to those of skill in the art upon reviewingthe above description. The scope of the invention should, therefore, bedetermined with reference to the following claims, along with the fullscope of equivalents to which such claims are entitled.

As used herein, ‘One or more’ includes a function being performed by oneelement, a function being performed by more than one element, e.g., in adistributed fashion, several functions being performed by one element,several functions being performed by several elements, or anycombination of the above.

The terminology used in the description of the various describedembodiments herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used in thedescription of the various described embodiments and the appendedclaims, the singular forms “a”, “an” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will also be understood that the term “and/or” as usedherein refers to and encompasses any and all possible combinations ofone or more of the associated listed items. It will be furtherunderstood that the terms “includes,” “including,” “comprises,” and/or“comprising,” when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

While terms of ordinance or orientation may be used herein, theseelements should not be limited by these terms. All terms of ordinance ororientation, unless stated otherwise, are used for purposesdistinguishing one element from another, and do not denote anyparticular order, order of operations, direction or orientation unlessstated otherwise.

We claim:
 1. A wiring harness assembly, comprising; a plurality of electrically conductive wires encased within a substrate formed of a dielectric material; an opening defined in the substrate, wherein a section of the plurality of electrically conductive wires is exposed within the opening; a support segment disposed within the opening; and a connector segment secured to the support segment, wherein the connector segment includes a plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.
 2. The wiring harness assembly according to claim 1, further comprising a location feature integrally formed with the substrate, wherein the location feature is selected from a list consisting of an edge of the substrate, a corner of the substrate, a notch in the substrate, a slot in the substrate, or a hole in the substrate.
 3. The wiring harness assembly according to claim 2, wherein the location feature is a fiducial mark configured for use as a point of reference to determine a location of the opening.
 4. The wiring harness assembly according to claim 3, wherein the fiducial mark is in the form of an object placed in a field of view of an automated assembly robot for use as a point of reference to determine the location of the opening.
 5. The wiring harness assembly according to claim 1, wherein the connector segment is configured to mate with a corresponding mating connector having a plurality of corresponding mating terminals.
 6. The wiring harness assembly according to claim 1, wherein the connector segment is received within the support segment.
 7. The wiring harness assembly according to claim 1, wherein each terminal in the plurality of terminals defines a forked end having two tines, wherein a wire of the plurality of electrically conductive wires is received between the two tines, and wherein the wire is compressively engaged by the two tines.
 8. The wiring harness assembly according to claim 7, further comprising a coating on outer surfaces of the plurality of electrically conductive wires formed of an electrically conductive material having a lower melting point than the plurality of electrically conductive wires and wherein one terminal in the plurality of terminals is metallurgically bonded to one electrical conductor in the plurality of electrically conductive wires by localized heating of the coating.
 9. The wiring harness assembly according to claim 8, wherein the support segment defines a plurality of recesses in which the two tines are received.
 10. The wiring harness assembly according to claim 1, wherein the support segment comprises a lower lip engaging a lower surface of the substrate around a perimeter of the opening and wherein the connector segment comprises an upper lip engaging an upper surface of the substrate around the perimeter of the opening.
 11. The wiring harness assembly according to claim 10, wherein the lower lip comprises a lower seal formed of a first compliant material and sealingly engaging the lower surface of the substrate around the perimeter of the opening and wherein the upper lip comprises an upper seal formed of a second compliant material and sealingly engaging the upper surface of the substrate around the perimeter of the opening.
 12. The wiring harness assembly according to claim 1, wherein the support segment comprises a lower seal formed of a first compliant material and sealing engaging a lower inner surface of the substrate within the opening and wherein the connector segment comprises an upper seal formed of a second compliant material and sealing engaging an upper inner surface within the opening.
 13. The wiring harness assembly according to claim 12, further comprising an inner seal formed of a third compliant material intermediate the connector segment and the support segment.
 14. The wiring harness assembly according to claim 1, wherein the support segment is integrally formed with the substrate.
 15. The wiring harness assembly according to claim 1, wherein the plurality of electrically conductive wires is arranged and maintained in a predetermined order.
 16. The wiring harness assembly according to claim 1, wherein a first region of the substrate surrounding the opening has a stiffness that is greater than a second region of the substrate remote from the opening.
 17. The wiring harness assembly according to claim 1, wherein the substrate is formed by an additive manufacturing process.
 18. The wiring harness assembly according to claim 17, wherein the additive manufacturing process is selected from a list consisting of 3D printing, stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, and laminated object manufacturing.
 19. The wiring harness assembly according to claim 2, wherein the opening is located within a predetermined tolerance relative to the location feature. 